Free resource for electronic component datasheets

Chip data Inventory inquiry Alternative model

67996-950HTLF Datasheet, PDF

  • Manufacturer model: 67996-950HTLF
  • Function description: Headers & Wire Housings BergStik, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 50 Positions, 2.54 mm (0.100in) Pitch
  • Manufacturer: Amphenol FCI
  • Data sheet:
  • Category: Headers & Wire Housings

67996-950HTLF Suppliers

*Submit information and send RFQ to all vendors on the following list

  • bpachip

    950HC

    National Semiconductor

  • bpachip

    950HM

    Rochester Electronics, LLC

  • bpachip

    67996-950HTLF

    Amphenol ICC (FCI)

  • bpachip

    950H

    Heat Wagon

  • bpachip

    67996-950HLF

    Amphenol ICC (FCI)

  • winsurf

    950H

    Heat Wagon

  • winsurf

    950HC

    National Semiconductor

  • winsurf

    950HM

    Rochester Electronics, LLC

  • winsurf

    67996-950HTLF

    Amphenol ICC (FCI)

  • winsurf

    67996-950HLF

    Amphenol ICC (FCI)

See More

67996-950HTLF Similar Part

  • 67996-950HTLF Headers & Wire Housings BergStik, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 50 Positions, 2.54 mm (0.100in) Pitch Amphenol FCI 13004 2.56
  • 67996-950HTLF CONN HEADER VERT Amphenol ICC (FCI) 373 0
  • 67996-950HTLF Amphenol FCi 13915 0
  • 67996-950HTLF Amphenol Communications Solutions 13934 0

67996-950HTLF Chip related model

Business contact email: info@finddatasheet.com