XNS50660AB(ABS) Datasheet, PDF
- Reference price Can ship immediately
- TI remarks How much is XNS50660AB(ABS) here? The last 7 days of 2023, today's bidding, today's bidding, XNS50660AB(ABS) wholesale/procurement quotation,XNS50660AB(ABS) market trend sales ranking, XNS50660AB(ABS) quotation.
XNS50660AB(ABS) Part Attribute
- Description IPM将功率器件连同其驱动电路和多种保护电路封装在同一模块内,进行过完美的匹配,使系统设计者从繁琐的驱动和保护电路设计中解脱出来,同时提高了系统的可靠性。 公司现有产品包括:IPM23,IPM24,IPM25,IPM26,IPM29。 封装形式有:DIP23,SOP23,PQFN,DIP24,DIP25,DIP26,DIP29。
- Part No. XNS50660AB(ABS)
- Manufacturer 芯能半导体-Xiner
XNS50660AB(ABS) Suppliers
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