TLV5610IYZ Datasheet, PDF
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- Description The TLV5610IYZ is the lead-free version of the TLV5610IYE, an eight-channel, 12-bit, voltage output digital-to-analog converter (DAC) with a flexible serial interface. The serial interface allows glueless interface to TMS320 and SPI, QSPI, and Microwire serial ports. It is programmed with a 16-bit serial string containing four control and 12 data bits. Additional features include a power-down mode, an LDAC input for simultaneous update of all eight DAC outputs, and a data output that can be used to cascade multiple devices. The resistor string output voltage is buffered by a rail-to-rail output amplifier with a programmable settling time to allow the designer to optimize speed versus power dissipation. The buffered, high-impedance reference input can be connected to the supply voltage. The TLV5610IYZ is implemented in a CMOS process and is available in a 20-terminal wafer chip-scale package (WCSP). The TLV5610IYZ is characterized for operation from -40°C to +85°C in a wire-bonded small outline (SO) package. The TLV5610IYZ is the lead-free version of the TLV5610IYE, an eight-channel, 12-bit, voltage output digital-to-analog converter (DAC) with a flexible serial interface. The serial interface allows glueless interface to TMS320 and SPI, QSPI, and Microwire serial ports. It is programmed with a 16-bit serial string containing four control and 12 data bits. Additional features include a power-down mode, an LDAC input for simultaneous update of all eight DAC outputs, and a data output that can be used to cascade multiple devices. The resistor string output voltage is buffered by a rail-to-rail output amplifier with a programmable settling time to allow the designer to optimize speed versus power dissipation. The buffered, high-impedance reference input can be connected to the supply voltage. The TLV5610IYZ is implemented in a CMOS process and is available in a 20-terminal wafer chip-scale package (WCSP). The TLV5610IYZ is characterized for operation from -40°C to +85°C in a wire-bonded small outline (SO) package.
- Part No. TLV5610IYZ
- Manufacturer 德州仪器-TI
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