ADSP-BF533 Datasheet, PDF
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ADSP-BF533 Part Attribute
- Description The ADSP-BF533 provides a high performance, power-efficient processor choice for today's most demanding convergent signal processing applications. The high performance 16-bit/32-bit Blackfin® embedded processor core, the flexible cache architecture, the enhanced DMA subsystem, and the dynamic power management (DPM) functionality allow system designers a flexible platform to address a wide range of applications including consumer,communications, automotive, and industrial/instrumentation. Architectural FeaturesHigh performance 16-bit/32-bit embedded processor core10-stage RISC MCU/DSP pipeline with mixed 16-bit/32-bit ISA for optimal code densityFull SIMD architecture, including instructions for accelerated video and image processingMemory management unit (MMU) supporting full memory protection for an isolated and secure environment High Level of IntegrationUp to 148 kB of on-chip SRAMGlueless video capture and display portTwo dual-channel, full-duplex, synchronous serial ports supporting eight stereo I2S channels12 DMA channels supporting one- and two-dimensional data transfersMemory controller providing glueless connection to multiple banks of external SDRAM, SRAM, Flash, or ROM160-ball mini-BGA, 169-ball PBGA packagesIndustrial temperature ranges (40°C to 85°C) and commercial temperature ranges (0°C to 70°C) available
- Part No. ADSP-BF533
- Manufacturer 亚德诺-ADI
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