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HMC-C007 Datasheet, PDF

  • Manufacturer model: HMC-C007
  • Function description: INGAP HBT DIVIDE-BY-8 MODULE 0.5
  • Manufacturer: Analog Devices Inc.
  • Data sheet:
  • Category: RF Misc ICs and Modules

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HMC-C007 Similar Part

  • HMC-C007 INGAP HBT DIVIDE-BY-8 MODULE 0.5 Analog Devices Inc. 35059 0
  • HMC-C007 InGaP HBT 8分频模块，0.5 - 18 GHz 亚德诺-ADI 19584 0

HMC-C007 Chip related model

HMC-C007 Related Specifications

6-2355644-4 1-2355626-1 2-2355627-1 2379513-1 8-2355626-1 1-2379513-1 8-2355632-1 2-2355626-1 1-2355627-1 6-2355626-4

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